Hot Air Tool Thermaltronics TMT-HA300

The TMT-HA300 hot air tool uses a large diaphragm pump and can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.

Digital display shows temperature and status.
Airflow meter provides visual feedback of air flow.
Large selection of high quality nozzles.
Adjustable, easy to use temperature and air control knobs.

Hot Air Tool Thermaltronics TMT-HA200

The TMT-HA200 hot air tool can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.

Auto sleep activated when hot air tool is placed in the holder.
Lightweight and compact, takes up minimal table space.
Large selection of high quality nozzles.
Adjustable, easy to use temperature and air control knobs.

Soldering & Rework Station TMT-5000S

The TMT-5000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material.

Curie Heat Technology operating at 13.56MHz.
Features our unique T Series line of tip cartridges.
Lightweight and compact, takes up minimal table space.
No calibration or operator training required.
No additional coil assembly costs.

Soldering & Rework Station TMT-9000S

The TMT-9000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material.

High thermal recovery & performance.
13.56MHz power supply with built-in LCD display.
Dual switchable soldering ports.
No calibration or operator training required.
No additional coil assembly costs.