Hot Air Tool Thermaltronics TMT-HA300
The TMT-HA300 hot air tool uses a large diaphragm pump and can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.
Hot Air Tool Thermaltronics TMT-HA200
The TMT-HA200 hot air tool can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.
Soldering & Rework Station TMT-5000S
The TMT-5000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material.
Soldering & Rework Station TMT-9000S
The TMT-9000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material.